400 Points Half Size Solderless Breadboard

Description

• High-Quality Build: The 400 Points Half Size Solderless Breadboard is constructed using high-quality materials to ensure durability and long-term reliability. It is designed to withstand repeated use and component insertions.
• 400 Connection Points: This breadboard features a total of 400 connection points or tie-points, which are arranged in a grid pattern. These points are used for securely inserting electronic components, such as resistors, capacitors, integrated circuits (ICs), and wires.
• Compact Size: As a half-size breadboard, it offers a compact and space-saving design compared to full-size breadboards. This makes it suitable for smaller projects, compact electronic devices, and situations where space is limited.
• Versatile Design: The breadboard’s layout is designed to accommodate a wide range of electronic components with different lead spacing. It allows for the creation of various circuits with ease.
• No Soldering Required: Like all solderless breadboards, this model eliminates the need for soldering, making it ideal for rapid prototyping and experimentation. Components can be easily inserted and removed without damage.
• Multiple Bus Strips: The breadboard typically includes multiple bus strips or rails along the edges, which are used for power distribution and ground connections. These strips simplify circuit wiring and organization.
• Transparent Housing: Many breadboards come with a transparent plastic housing that provides visibility of the components and connections, aiding troubleshooting and circuit inspection.
• Reusable and Expandable: Solderless breadboards are reusable, meaning you can disassemble and reconfigure circuits as needed. You can also expand your circuit by connecting multiple breadboards together when working on more extensive projects.